Qlogic QLA2300 Installation Guide Page 27

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FC2251101-00 D B-1
Appendix B
Specifications
Table B-1. QLA23xx Board Operating Environment
Environment Minimum Maximum
Operating temperature 0°C/32°F 55°C/131°F
Storage temperature -20 °C/-4 °F 70°C/158°F
Relative humidity (noncondensing) 10% 90%
Storage humidity (noncondensing) 5% 95%
Table B-2. QLA23xx Board Specifications
Type Specification
Host bus Conforms to PCI Local Bus Specification, revision 2.2 and the PCI-X
Addendum, revision 1.0
PCI/PCI-X
signaling
environment
3.3 V and 5.0 V buses supported
PCI/PCI-X
transfer rate
132 MBps maximum burst rate for 32-bit PCI operation at 33 MHz
264 MBps maximum burst rate for 32-bit PCI/PCI-X operation at 66 MHz
264 MBps maximum burst rate for 64-bit PCI operation at 33 MHz
528 MBps maximum burst rate for 64-bit PCI/PCI-X operation at 66 MHz
1GBps maximum burst rate for 64-bit PCI-X operation at 133 MHz
(QLA2312F/2312FL)
Fibre
Channel
specifications
Bus type: Copper media, twisted pair (QLA2300/QLA2310)
Multimode fibre optic media (QLA2300F/QLA2302F/QLA2310F/
QLA2312F/QAL2312FL)
Bus transfer rate: 200 MBps maximum at half-duplex
400 MBps maximum at full-duplex
Interface chip: ISP2300 (PCI QLA2300/2300F/2302F boards)
ISP2310 (PCI-X QLA2310/2310F/2310FL boards)
ISP2312 (PCI-X QLA2312F/2312FL boards)
CPU Single-chip design that includes a QLogic RISC processor, Fibre Channel
protocol manager, PCI/PCI-X DMA controller, and integrated
serializer/deserializer (SERDES) and electrical transceivers that can
auto-negotiate a data rate of 1 Gbps or 2 Gbps
RAM 256 KB of sync SRAM supporting parity protection
BIOS ROM 128 KB of flash ROM in two 64-KB, software selectable banks. The flash
is field programmable.
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